Development of rain sensor that can solve raindrop detection efficiency problem and maximize rain sensing efficiency by optical interference structure of light source


VCM ACTUATOR requiring manual operation can be technically and business competitively by changing the material, simplifying the manufacturing process, minimizing the defect rate, and automating the production by M-PCB method.

센서토피아의 새로운 소식을 전합니다.

19. 08. 09: 특허 10-2007207호의 PCT 출원(PCT/KR2019/010069호).



OIS관련 신규 특허 1건 등록(10-2007207호)


19. 07. 30일 18.12.27 출원한 10-2018-0170915호,“카메라 모듈의 위치보정용 기판 어셈블리, 이의 제조방법 및 이를 포함하는 카메라 모듈”특허등록.

강원대학교와 기술이전계약(전용실시권) 체결


19. 07. 01일 강원대학교와 기술이전계약("WSR 관계식 계산 알고리즘“/ C-2017-032359호,전용실시권) 체결, 강원대와 공동으로 실시간 강우정보측정이 가능한 차량용

Rain Sensor

This sensor replaces the ETACS that controls the wiper motor drive and is installed inside the top of WINDSHIELD.

The sensor is a crucial part that automatically controls wiper operating time and low/high operation speed according to rainfall detection. As a means to increase the efficiency of raindrop detection on the surface of windshields, we installed a light source and a light receiving element on the surface of the windshield. The system is designed to prevent direction penetration of some light of the light source besides the light that discharge outside the windshield, thereby providing a solution to the problem that deteriorate raindrop detection due to interfering light of the light source (sensing noise). We developed a rain sensor that maximizes the rain sensing function with an optical interference structure of light source.

Rain Sensor
Pattern Coil
Pattern Coil

Optical Image Stabilizer

There are two ways to implement the OIS: shifting and tilting. Four enameled wires each having an ultra-fine diameter of 35 to 40 μm are coiled and soldered 80 to 100 times in the form of an elliptical loop and solder. All VCM ACTUATORs around the world use 100% enamel coils. All processes (fabrication/ inspection) except for the winding process are manual using microscopes. Due to the characteristics of ultra-small diameter enameled wire in mass production, defect rates are extremely high in winding wire, soldering, and foreign matter. We endeavor to develop methods to secure technological and business competitiveness by changing materials, simplifying manufacturing processes, minimizing defect rate, and automating production. In addition, we are initiative in solving the problems by using multi-layer printed circuit board (M-PCB) pattern coil and modularization for automation.

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